SEMI103 Hybrid Integration Techniques for Flexible Electronics StdPbc-0718 This Standard is applicable to

This Standard is applicable to sensors which are regarded as data producers only

2-0621 (Reapproved 0723)

3 This Document applies to the class of prober equipment in which the wafer is unloaded from the same slot in the same carrier which loaded the wafer after processing

This Standard is applicable to display quality evaluations standard of flat panel display modules or flat panel TVs

SEMI103 Hybrid Integration Techniques for Flexible Electronics StdPbc-0718 This Standard is applicable toTCourse Description This course describes techniques practiced at Palo Alto Research Center for fabricating flexible hybrid electronics. Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits, and integrating sensors of different types. The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates and also the development of electronics on textiles. Course Objectives