G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded • extract the edge profile

• extract the edge profile parameters directly from the measured edge profile at defined distances from the periphery of the wafer and compare them with the specified values

SEMI E22-0697 (Reapproved 0309)

SEMI D34-0710 (technical revision)

SEMI E133-1104 (technical revision)

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded • extract the edge profileNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.