G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications originally published February 2000

originally published February 2000

although the test procedure may prove useful in corrosion studies

which provides a unified standard for the manufacture

previously published November 2013

G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications originally published February 2000Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of