E13700 - SEMI E137 - Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment Revision:SEMI E137-0705 (Reapproved 1111) - Superseded Physical characteristics specific to each

Physical characteristics specific to each component

Health and Safety Guideline for Documents Provided to the Equipment User for Use with Semiconductor Manufacturing Equipment

SEMI E30-0224 (technical revision)

Provide guidelines of applying appropriate security measures for equipment to optimize cost

E13700 - SEMI E137 - Guide for Final Assembly, Packaging, Transportation, Unpacking, and Relocation of Semiconductor Manufacturing Equipment Revision:SEMI E137-0705 (Reapproved 1111) - Superseded Physical characteristics specific to eachThis Standard was technically approved by the Facilities Global Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on May 16, 2017. Available at www. semiviews. org and www. semi. org in January 2018; originally published November 2004; previously published November 2011. E This Standard was editorially modified to make corrections that were approved outside of the normal reapproval process.