C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0094 SMN as described in this

SMN as described in this Specification standardizes an XML notation that can be used for both the logging and documentation of SECS-II messages

The damage is revealed by a preferential etch that removes silicon in the region of the deformation

For event information

그 내용이 가지는 의미와 장비에서 지원하는 데이터가 어떤 인터페이스로 관리되는지를 정의한다

C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0094 SMN as described in thisThe purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap