Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Ingestion-build-51747 Improve their environmental performance

Improve their environmental performance

The test method documented in BS EN 61000-4-6 describes a consistent method to assess the immunity of an equipment or system against a defined phenomenon

Fire tests for furniture - Part 2

To size mass-produced clothes

Environmental testing - Tests. Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Ingestion-build-51747 Improve their environmental performance1 Scope This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead free alloys. The procedures use either a solder bath or reflow method and are applicable only to specimens