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G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title SEMI MF978-1106 (technical revision)
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title SEMI MF978-1106 (technical revision)
$180.00
Description
SEMI MF978-1106 (technical revision)
to image the sample topography
This Guide should be used in conjunction with SEMI F63 and SEMI F75
SEMI G86-0303 (Reapproved 0811)
G01900 - SEMI G19 - エッチングにより製造されるDIPリードフレームのための仕様 Revision:Default Title SEMI MF978-1106 (technical revision)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org19801997 : DIP Referenced SEMI Standards SEMI G10 Standard Method for Mechanical Measurement of Plastic Package Leadframes SEMI G18 Specification for Integrated Circuit Leadframe Material Used in the Production of Etched Leadframes
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