Advanced Packaging including Heterogeneous Integration & Chiplets 6/8 ElnTpc-Safety - Facility/Workplace Significant security requirements (e

Significant security requirements (e

and provide reference for various characteristic features and contaminants that are seen on highly specular silicon wafers

2-0621 (Reapproved 0925)

1 The purpose of this Specification is to define a secure

Advanced Packaging including Heterogeneous Integration & Chiplets 6/8 ElnTpc-Safety - Facility/Workplace Significant security requirements (eAdvanced Packaging incl. Heterogeneous Integration & Chiplets Dates & Times June 8th June 9th 7: 30 11: 30 PT Early Bird Pricing $100 off Member $845 $745 Non Member $ 945 $845 Location Virtual This one day course addresses IC packaging, assembly, and package substrate and Heterogeneous Integration & Chiplets. It stresses the impact of the IC and end product requirements, i. e., smaller, better, cheaper and their influence on the manufacturing