Packaging of components for automatic handling - Introduction of a bulk blister pack for miniaturized components Ingestion-build-50790 4 Construction

4 Construction

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Packaging of components for automatic handling - Introduction of a bulk blister pack for miniaturized components Ingestion-build-50790 4 Construction1 Scope This part of IEC 60286 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.