TECu1-12710 Thermoelectric Peltier Chip Module Copper Substrate cooling one of the tubs

cooling one of the tubs of water to freezing or below if needed

It is food safe

Recommended for applications that need the most power and fastest thermal response in a compact package

Because copper is a soft metal

TECu1-12710 Thermoelectric Peltier Chip Module Copper Substrate cooling one of the tubsTECu1 12710 Superior efficiency & performance compared to 12705 (if used correctly) This is a specialized Peltier module with two unique features: Maximum attainable heat transfer with ultra thin copper plates instead of the traditional ceramic plates. Ultra thin 1. 92mm overall module thickness compared to 3. 2 3. 9mm that is typical for 40*40mm modules. Even heat dissipation across the entire surface. Recommended for applications that need the most