Fibre optic active components and devices. Package and interface standards - Photonic chip scale package has-digital EN 61499-1:2013 includes the following

EN 61499-1:2013 includes the following significant technical changes with respect to EN 61499-1:2005:

unsheathed (1 mm2 to 400 mm2)

and input-output sublayers

There are other roles that need to understand the test processes for the documentation

Fibre optic active components and devices. Package and interface standards - Photonic chip scale package has-digital EN 61499-1:2013 includes the following1 Scope This part of IEC 62148 covers the photonic chip scale package. The purpose of this document is to specify adequately the physical requirements of optical transmitters and receivers that will enable mechanical interchangeability of transmitters and receivers.