YAlO3 (010) 5x5x0.5mm, 1 side polished Flow cell test system Diamond wire cutting is a

Diamond wire cutting is a state of the art technology to slice single crystal wafer or substrate

Minimum Current interval: 24 mA

ID:      64 mm

Surface Quality: two sides optical polished 60/40

YAlO3 (010) 5x5x0.5mm, 1 side polished Flow cell test system Diamond wire cutting is aSpecifications: Single crystal: YAlO3 Substrate Size: 5mm x 5mm x 0. 5mm+ 0. 5 o Orientation: (010)+ 0. 5 o ( Please pay attention to the order of lattice constants as the table below ) Polished: one side polished Surface Roughness: < 5A Packing: 1000 class clean room and bag Structure Lattice (A) Melting Point Density g cc Dielectric Constant Thermo Expans x10 6 K Max. Xtl Size Orthor. a=5. 3286(4) b=7. 3706(5) c=5. 1796(3) 1870 0C 4. 88 16 20 2 10