Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting EQ-DW0125x65 Pouch Cell Resistivity: 10E3 ~ 10E4 ohm-cm
$5635.00
Description
Resistivity: 10E3 ~ 10E4 ohm-cm
Spinning Time: 1 - 60s
Material Cubic Boron Nitride
Options Please click the picture to find other size Coin cell and Crimper
Diamond Wire of 0.125 mm Dia. x 65 m L (215 feet) for Wire Saw Cutting EQ-DW0125x65 Pouch Cell Resistivity: 10E3 ~ 10E4 ohm-cmDiamond wire cutting is a state of the art technology to slice a single crystal wafer or substrate. The diamond wire produces minimum kerf loss, less sub surface damage, and contamination free coolant during crystal cutting. Through several years of effort, finally, MTI provides the market a quality diamond wire at a reasonable price. Specifications: Part Number EQ DW0125x65 Tensile Strength 30 N Features Electroplated diamond wire with 0. 125 mm (+
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